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Method for a ground spline package design

IP.com Disclosure Number: IPCOM000009495D
Publication Date: 2002-Aug-28
Document File: 1 page(s) / 42K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a ground spline package design. Benefits include improved printed circuit board (PCB) layout.

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Method for a ground spline package design

Disclosed is a method for a ground spline package design. Benefits include improved printed circuit board (PCB) layout.

Background

        � � � � � Conventionally, the ground ball-grid array (BGA) pads are distributed between the input/output (I/O) BGA pads to achieve the desirable ground-to-I/O ratio (see Figure 1). The larger pads are via in BGA pads (see Figure 1). A drill is in the formerly undrilled BGA pad. The maximum number of routes in 3 rows is 15, stretchable to 16.

Description

        � � � � � The disclosed method is a ground spline package design. The ground (GND) distribution is accomplished by a single row for every three rows of the package, enabling a less obstructed path for other routes.

        � � � � � The larger pads are standard vias (see Figure 2). BGA pads remain the standard size. The maximum number of routes in 3 rows is 19, stretchable to 20.

Advantages

        � � � � � The disclosed method improves PCB layout because one dedicated return column interferes less with the route channels.

Fig. 1

Fig. 2

Disclosed anonymously