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Method for straight-edge copper meshing to fill incomplete squares with copper on MMAP strips

IP.com Disclosure Number: IPCOM000009503D
Publication Date: 2002-Aug-28
Document File: 2 page(s) / 80K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for straight-edge copper meshing to fill incomplete squares with copper on matrix-molded area package (MMAP) strips. Benefits include improved reliability.

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Method for straight-edge copper meshing to fill incomplete squares with copper on MMAP strips

Disclosed is a method for straight-edge copper meshing to fill incomplete squares with copper on matrix-molded area package (MMAP) strips. Benefits include improved reliability.

Background

Delamination of the solder mask from core and copper interfaces occurs in high-density stacked chip scale packages (HDSCSP) using thin core (100-µm) material during reliability stress tests.

In conventional meshing, solid copper is etched away in a meshing pattern to provide better adhesion for solder masking to base core material. Several types of meshing patterns are in use. One type of mesh design uses scalloped edges and incomplete square openings in the copper mesh (see Figure 1). This approach results in the entrapment of chemicals during the copper-plating process and poor adhesion of solder mask to core.

Description

The disclosed method is straight-edge copper meshing with metal-filled incomplete squares� (see Figure 2) to minimize delamination in substrates as the core thickness decreases to meet customer requirements for thinner packages. The layers affected by delamination include core/solder mask and copper/solder mask interfaces.

The key element of the method is straight-edge meshing with filled incomplete squares to eliminate chemical entrapment and improve solder mask adhesion to the core and copper.

Advantages

        � � � � � The disclosed method provides advantages, including:

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