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Method for heatsink attachment that improves BGA reliability

IP.com Disclosure Number: IPCOM000009507D
Publication Date: 2002-Aug-28
Document File: 3 page(s) / 479K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for heatsink attachment that improves ball-grid array (BGA) reliability. Benefits include improved reliability.

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Method for heatsink attachment that improves BGA reliability

Disclosed is a method for heatsink attachment that improves ball-grid array (BGA) reliability. Benefits include improved reliability.

Background

              Solder-joint reliability for BGA packages is a major issue due to the bending of the printed circuit board (PCB) that results from conventional retention methods. The package load is not adequately supported on the underside. For many designs, the board is used as a spring element in the system.

General description

      The disclosed method is a mechanical design for attachment of a heatsink to the package/board assembly (see Figure 1).

      The key elements of the method include:

·        U-shaped support bracket, which supports loads applied to the package and heatsink

·        Spring clip that is designed to meet ergonomic requirements while providing simple tool-free installation

·        Small keep-out zones for the support bracket and spring

Advantages

      The disclosed method provides advantages including:

·        Improved reliability due to a great reduction in adverse effects on the board, such as bending, permanent deflection, and warpage

·        Improved reliability due to reduction or elimination of sheer stresses on the BGA solder joints because the board is fully supported and does not bend

·        Improved assembly process

·        Reduced hardware count compared to conventional designs

Detailed description

              The disclosed method is a support bracket and spring c...