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Method for ultrasonic bonding tape-substrate preparation

IP.com Disclosure Number: IPCOM000009509D
Publication Date: 2002-Aug-28
Document File: 3 page(s) / 175K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for ultrasonic bonding tape-substrate preparation. Benefits include improved ease of manufacturing.

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Method for ultrasonic bonding tape-substrate preparation

Disclosed is a method for ultrasonic bonding tape-substrate preparation. Benefits include improved ease of manufacturing.

Background

        � � � � � Conventional tape preparation is performed by applying adhesive tape on the frame and substrate to join them (see Figure 1).

Description

        � � � � � The disclosed method is for ultrasonic bonding tape-substrate preparation. The method utilizes ultrasonic energy in bonding the substrate and frame carrier. The basic requirement for the method is that the tape-substrate has a copper plating on the sprocket area where the bonding occurs.

        � � � � � The method is comprised of six modules (see Figure 2):

•        � � � � Frame pick-and-place

•        � � � � Frame shuttle

•        � � � � Substrate pick-and-place

•        � � � � Substrate feeder

•        � � � � Substrate cutting

•        � � � � Ultrasonic modules

        � � � � � The frame pick-and-place picks-up the copper frames and puts them on the frame shuttle. The frame shuttle serves as a vehicle for the frame and substrate as it goes through the process. The substrate feeder is where the substrate is rolled out. Usually, the substrates are packed on a reel. The substrate is feed into the cutting module where the substrate is cut to a predetermined length. After the cutting module, the substrate is taken by the pick-and-place bar and put on top of the copper frame.

        � � � � � The shuttle transports the frame and substrate towards the ultrasonic bonding module. It i...