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Method for ultrasonic bonding tape-substrate preparation

IP.com Disclosure Number: IPCOM000009509D
Publication Date: 2002-Aug-28
Document File: 3 page(s) / 180K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for ultrasonic bonding tape-substrate preparation. Benefits include improved ease of manufacturing.

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Method for ultrasonic bonding tape-substrate preparation

Disclosed is a method for ultrasonic bonding tape-substrate preparation. Benefits include improved ease of manufacturing.

Background

              Conventional tape preparation is performed by applying adhesive tape on the frame and substrate to join them (see Figure 1).

Description

              The disclosed method is for ultrasonic bonding tape-substrate preparation. The method utilizes ultrasonic energy in bonding the substrate and frame carrier. The basic requirement for the method is that the tape-substrate has a copper plating on the sprocket area where the bonding occurs.

              The method is comprised of six modules (see Figure 2):

•             Frame pick-and-place

•             Frame shuttle

•             Substrate pick-and-place

•             Substrate feeder

•             Substrate cutting

•             Ultrasonic modules

              The frame pick-and-place picks-up the copper frames and puts them on the frame shuttle. The frame shuttle serves as a vehicle for the frame and substrate as it goes through the process. The substrate feeder is where the substrate is rolled out. Usually, the substrates are packed on a reel. The substrate is feed into the cutting module where the substrate is cut to a predetermined length. After the cutting module, the substrate is taken by the pick-and-place bar and put on top of the copper frame.

              The shuttle transports the frame and substrate towards the ultrasonic bonding module. It i...