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Method for double-sided tape/substrate preparation

IP.com Disclosure Number: IPCOM000009510D
Publication Date: 2002-Aug-28
Document File: 3 page(s) / 94K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for double-sided tape/substrate preparation. Benefits include improved throughput.

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Method for double-sided tape/substrate preparation

Disclosed is a method for double-sided tape/substrate preparation. Benefits include improved throughput.

Background

              The conventional process of tape preparation attaches the substrate to the frame carrier using a single-sided high-temperature tape (HTT). The attachment is performed in the following order:

1.           Frame carrier

2.           Substrate
3.           HTT

              This solution is space consuming. The HTT occupies a surface area where more units can be placed on a strip. When more units are placed per strip, more units can be processed per hour, especially on the machines that process the units in a per-frame basis, such as mold, plasma clean, ball attach, and reflow.

Description

              The disclosed method is double-sided tape/substrate preparation. The apparatus is comprised of five major assemblies, including (see Figure 1):

•             Frame shuttle (a)

•             Punch and attach (b)

•             Top-liner removal (c)

•             Substrate pick and place (d)

•             Pressing modules (e)

              Minor assemblies are comprised of:
 •            Frame carrier pick and place (f)

 •            Substrate feeder (g)

 •            Substrate cutting module (h)

              The frame shuttle serves as a vehicle for the frame carrier and the substrate taping process. The shuttle is mounted on a linear bearing and moves in a horizontal direction (see Figure 2). The shuttle is moved by a servomotor for the accurate indexing.

              The pu...