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APPLICATION OF DYNAMIC MECHANICAL ANALYZER TO WlRE/WlREBOND FATIGUE TESTING

IP.com Disclosure Number: IPCOM000009581D
Original Publication Date: 1999-Sep-01
Included in the Prior Art Database: 2002-Sep-04
Document File: 1 page(s) / 73K

Publishing Venue

Motorola

Related People

Tomasz Klosowiak: AUTHOR [+3]

Abstract

Most electronic products use devices that contain wirebonds to make electrical interconnection to silicon die or leads external to the package. Due to the different thermal coefficients of expansion (TCE) of the various materials used within an electronic product, relative movement occurs between the various components within the product as temperature changes take place. In the case of a wirebond, this relative movement flexes the bonded wire, thereby fatiguing the wire and the bond.

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Developmenls Technical 0 M MOTOROLA

APPLICATION OF DYNAMIC MECHANICAL ANALYZER TO WlRE/WlREBOND FATIGUE TESTING

by Tomasz Klosowiak, Charles Van Dommelen and Mark Younghouse

ABSTRACT load of a specified amplitude at a specified frequen- cy or range of frequencies. By fabricating a carrier Most electronic products use devices that con- that can be wirebonded with, theoretically, any type tain wirebonds to make electrical interconnection to of wire composition, loop configuration and length, silicon die or leads external to the package. Due to we can cyclically fatigue the wire and/or bond to the different thermal coefficients of expansion failure. With the addition of a simple timing circuit (TCE) of the various materials used within an elec- controlled by wire continuity, we were able to mea- tronic product, relative movement occurs between sure the time to failure and thus calculate the num- the various components within the product as tem- ber of cycles to failure. Knowing the fatigue life of perature changes take place. In the case of a wire- the wire, one can then make more accurate predic- bond, this relative movement flexes the bonded tions of reliability of the entire package.
wire, thereby fatiguing the wire and the bond.

                                  Various experimental designs of the carriers To accurately predict the reliability of any elec- were fabricated and tested in the application and tronic product, it is important to know the fatigue found to be suitable. Several of these...