Browse Prior Art Database

Method for an extruded tray design for the bulk transporting of IC components and/or assembly packages

IP.com Disclosure Number: IPCOM000009593D
Publication Date: 2002-Sep-04
Document File: 6 page(s) / 632K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an extruded tray design for the bulk transporting of IC components and/or assembly packages. Benefits include improved throughput.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Method for an extruded tray design for the bulk transporting of IC components and/or assembly packages

Disclosed is a method for an extruded tray design for the bulk transporting of IC components and/or assembly packages. Benefits include improved throughput.

Background

        � � � � � Component damage can occur during the loading, storing, transporting, and unloading of IC components or assemblies. Existing technologies include the use of injection-molded trays
(JEDEC style) in one piece and thermoformed closed-bottom versions. Industry unloading practices for most components and assemblies are accomplished with manual handling. Components may be loaded onto a JEDEC tray via automated equipment, but unloading is typically done by hand. JEDEC-style trays (injection molded or thermoformed) require tray handling that results in finger contact on sensitive features (see Figure 1). The result can be that unacceptable damage occurs to components or assemblies.

� � � � � Although the thermoformed version of the tray provides improvement by preventing fingers from touching the bottom of the assembly or component, access for removal is not improved, and the product is very difficult to remove manually.

General description

        � � � � � The disclosed method is a low-cost design to protect IC components or assemblies during handling, storage, and transport.

        � � � � � The key elements of the disclosed method include:

•        � � � � One-piece tray designed to be extruded, rather than injection molded or thermoformed. When two or more trays are stacked, intercepting each other along the perimeters, they form a semi-complete enclosure around the components contained inside. Ends are open for component accessibility.

•        � � � � Set of features that interlock the trays when stacked and banded. The features interact so that two trays cannot shift excessively relative to each other in y-axis or z-axis movement. X-axis restraint is provided by an outer pack during transport and storage.

•        � � � � Set of features that maintain spacing during shipment and storage to prevent component-to-component contact, except along two of the four component/assembly edges.

•...