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Method for self-aligning DLA/heatsink applications

IP.com Disclosure Number: IPCOM000009595D
Publication Date: 2002-Sep-04
Document File: 2 page(s) / 35K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for self-aligning direct lid attach (DLA)/heatsink applications. Benefits include improved reliability.

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Method for self-aligning DLA/heatsink applications

Disclosed is a method for self-aligning direct lid attach (DLA)/heatsink applications. Benefits include improved reliability.

Background

        � � � � � An external heatsink attached to the top of a DLA exerts enough force to cause mechanical stress and can cause the die to crack. Most of the stress is exerted during assembly. Uneven forces during assembly can compound the stress exerted on the die, detaching the DLA and cracking the die.

Description

        � � � � � The disclosed method is a 10-Gb Ethernet device that incorporates the DLA affixed to the silicon (see Figure 1). The DLA/heatsink combination can be affixed to the top of the die, effectively functioning as a DLA lid.

        � � � � � This method expands on existing technology by adding a mechanism for self-aligning the DLA/heatsink. The mechanism includes a set of gaskets fixed to the bottom of the DLA/heatsink that perform two functions. The gaskets absorb shock to address mechanical stress and aid in the alignment of the DLA/heatsink combination to the lower half of the package (see Figure 2).

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved reliability due to the self-aligning mechanism

•        � � � � Improved reliability due to absorbing shock and mechanical stress, preventing cracking and detachment

Fig. 1

 


Fig. 2

Disclosed anonymously