Browse Prior Art Database

Method for a folded foil interconnection

IP.com Disclosure Number: IPCOM000009596D
Publication Date: 2002-Sep-04
Document File: 2 page(s) / 48K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a folded foil interconnection. Benefits include improved functionality and improved ease of manufacturing.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 69% of the total text.

Method for a folded foil interconnection

Disclosed is a method for a folded foil interconnection. Benefits include improved functionality and improved ease of manufacturing.

Description

        � � � � � The disclosed method utilizes a metal (or other conductive material) foil to enable the circuit path from the input/output (I/O) side (active side) of the die to the top of the die to provide the interconnection path. Metal foil that provides a circuit path to top of the die can be prerouted with an appropriate I/O routing. Alternatively, the foil can be routed after it is wrapped around the die (using laser or similar cutting tools). Bump connection between the foil and the die can be completed with flip-chip type assemblies, such as controlled collapse chip collect (C4) and anisotropic conductive film (ACF). Die connection to the metal foil can be completed before or after wrapping the foil around the die (see Figure 1).

        � � � � � Packages use flex circuit or simple adhesive tape with pads and lines that are developed using standard etching or impression printing processes. Thermal comparison bonding or C4-type reflow processes can be used to attach the carrier tape pads to the bump side of the die. A folded circuit is wrapped around the die (two sides or four sides). The wrapping completes the folding process by attaching the top-side pads to the top of the die.

        � � � � � The carrier tape connection pads can be exposed and accessible on both sides of the tape. This technique enab...