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Method for a housing-less fan attachment to an extruded cross-flow heatsink

IP.com Disclosure Number: IPCOM000009602D
Publication Date: 2002-Sep-04
Document File: 2 page(s) / 99K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a housing-less fan attachment to an extruded cross-flow heatsink. Benefits include improved performance and improved noise reduction.

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Method for a housing-less fan attachment to an extruded cross-flow heatsink

Disclosed is a method for a housing-less fan attachment to an extruded cross-flow heatsink. Benefits include improved performance and improved noise reduction.

Background

� � � � � Conventional fans typically have housings that surround the impeller. However, breakthroughs in impeller design coupled with test data show significant gains in fan performance with the exclusion of the fan housing. This approach creates a problem because the fan loads are transferred to the heatsink via the fan housing.

Description

        � � � � � The disclosed method is a low-cost plastic component that interfaces with a vertically finned, cross-flow heatsink (see Figure 1). The components of the disclosed method are the interface with the fan and the heatsink. By adding one or more crosscuts and one or more hooks in the direction of extrusion, hooks can interface with the heatsink and support the fan through shock loading in any direction. In addition, hooks exist on the opposite side of the fan attachment that interfaces with the fan printed circuit board housing, transferring the fan loads to the heatsink and motherboard.

Advantages

� � � � � Some implementations of the disclosed structure and method provide one or more of the following advantages:

•        � � � � Improved performance due to the fan pulling in more air from the sides, increasing its efficiency

•        � � � � Improved performance due to lengthening the fan blades t...