Browse Prior Art Database

DUAL INTEGRATED CIRCUIT CONTROLLED CHIP COLLAPSE CONNECTION (C4) ONTO A LAMINATED MATRIX SUBSTRATE

IP.com Disclosure Number: IPCOM000009625D
Original Publication Date: 2000-Jan-01
Included in the Prior Art Database: 2002-Sep-05
Document File: 2 page(s) / 92K

Publishing Venue

Motorola

Related People

Richard Greenwalt: AUTHOR [+2]

Abstract

This paper describes a concept for the packaging of integrated circuit (IC) components which extends the application of existing manufacturing technolo- gy while providing end use customers with cost and size advantages.

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MOTOROLA Technical Developments

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DUAL INTEGRATED CIRCUIT CONTROLLED CHIP COLLAPSE CONNECTION (C4) ONTO A LAMINATED MATRIX SUBSTRATE

by Richard Greenwalt and Bob LaBelle

INTRODUCTION

  This paper describes a concept for the packaging of integrated circuit (IC) components which extends the application of existing manufacturing technolo- gy while providing end use customers with cost and size advantages.

PROBLEM TO BE SOLVED

  Existing methods and materials for intercomtect- ing integrated circuits utilize considerable space on circuit boards and impede transmission rates. Additionally, these methods typically require signif- icant investment in advanced technology and typi- cally incorporate horizontal integration, which con- strains the customer's product size reduction efforts.

PROPOSED SOLUTION TO THE PROBLEM

  The solution is to offer dual die and modular systems, which have integrated circuits on both sides of the customer laminate substrate. Currently available chip attachment techniques and laminate fabrication technologies support this as a viable solution. However, the techniques and tooling required for attaching integrated circuits on both sides of the substrate will require limited engineer- ing development. Figure 1 depicts the major com- ponents and general structure of the packaging con- cept. Using this approach, several benefits may be realized:

1) Increased IC capacity and modularity.

  2) Optimized horizontal board space utilization and, therefore, reduced cost.

  3) Decr...