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Method for a heavily coated HCD socket to shield from EMI and ESD

IP.com Disclosure Number: IPCOM000009879D
Publication Date: 2002-Sep-25
Document File: 2 page(s) / 106K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a heavily coated host controller device (HCD) to shield from electromagnetic interference (EMI) and electrostatic discharge (ESD). Benefits include improved performance and improved reliability.

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Method for a heavily coated HCD socket to shield from EMI and ESD

Disclosed is a method for a heavily coated host controller device (HCD) to shield from electromagnetic interference (EMI) and electrostatic discharge (ESD). Benefits include improved performance and improved reliability.

Background

              High performance processors require improved EMI and ESD solutions. No perfect conventional solution exists at the heatsink, heat spreader, and die/package levels. Although heatsink can be grounded and more shielding and absorbing material can be added to reduce the EMI radiation or reduce the ESD susceptibility, the open box is always a risk. Moreover, EMI and ESD issues impact the whole design. This problem is expected to increase in importance as products require higher power and high-frequency performance.

              The conventional HCD socket sidewall is used for clamping the package and holding the compression mounted land-grid array (LGA) plane.

General description

              The disclosed method is a heavily metal-coated HCD socket to shield EMI and protect from ESD. The key elements of the disclosed method include:

•     Heavily coated HCD socket for side walls

•     Enhanced height of the socket to reach the heatsink

•     IHS and package that are buried in the socket

•     Advanced EMI shielding and ESD protection

Advantages  

              The disclosed method provides advantages, including:

•     Improved performance and reliability due to...