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Method for a thermal solution attachment

IP.com Disclosure Number: IPCOM000009880D
Publication Date: 2002-Sep-25
Document File: 2 page(s) / 74K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a thermal solution attachment. Benefits include improved reliability and improved ease of manufacturing.

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Method for a thermal solution attachment

Disclosed is a method for a thermal solution attachment. Benefits include improved reliability and improved ease of manufacturing.

Background

              High stress on the printed circuit board (PCB) results from the typical methods used to attach thermal solutions, such as heatsinks, causes the board to bend (see Figure 1). Conventional designs use spring mechanisms with high spring rates and low deflection or rely on the PCB to provide and maintain the load through bending the board.

              Conventional heatsink attachment methods use a variety of fasteners, retention modules, clips, and additional holes through the board.

Description

              The disclosed method attaches a thermal solution with a U-shaped support bracket and two spring mechanisms (see Figure 2). The bracket is made from steel or other suitable material. The bracket supports the applied load. The bracket is installed through holes in the PCB (see Figure 3). The springs can be attached by hand without tools. The spring bars have a low spring rate and operate through a substantial deflection distance during load application.

Advantages

              The disclosed method provides advantages, including:

•             Improved reliability due to the reduction of board stresses (such as pwb flexure, preload, and relaxation)

•             Improved reliability due to the indefinite maintenance of the load without deterioration because the PCB is not used as a spring

•           ®..