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Method for multiple die stacking and folding

IP.com Disclosure Number: IPCOM000009881D
Publication Date: 2002-Sep-25
Document File: 3 page(s) / 72K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for multiple die stacking and folding. Benefits include improved productivity, improved process simplicity, and improved manufacturability.

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Method for multiple die stacking and folding

Disclosed is a method for multiple die stacking and folding. Benefits include improved productivity, improved process simplicity, and improved manufacturability.

Description

              The disclosed method is composed of five encapsulated or molded IC units placed on a cross-shaped layout flexible substrate (see Figure 1). Each IC unit has one or more silicon die vertically stacked. The two units from the x-axis of the design are then folded, followed by the folding of two units from y-axis of the design (see Figure 2). Pin outs or ball layout are located at the bottom of the center unit.

              The method accommodates five or more silicon die vertically integrated in a single package. This approach minimizes handling at the die attach and wire bond process, due to enabling a one-step process. Likewise, it minimized wires crossing at wire-bond because the dice are laid out horizontally.

              Moreover, the disclosed method provides the flexibility to combine different types of dice. It can also combine different die sizes, which has a minimal impact to manufacturability. Some advantages of handling different die sizes are:

•             Minimize die cracking at wirebond due to the springboard motion of a die overhang with 3-mil die thickness or less

•             Eliminating the requirement for a silicon spacer (see Figure 3)

Advantages

              The disclosed method provides advantages, including:

•             Improved productiv...