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Method for multiple die stacking and folding

IP.com Disclosure Number: IPCOM000009881D
Publication Date: 2002-Sep-25
Document File: 3 page(s) / 77K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for multiple die stacking and folding. Benefits include improved productivity, improved process simplicity, and improved manufacturability.

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Method for multiple die stacking and folding

Disclosed is a method for multiple die stacking and folding. Benefits include improved productivity, improved process simplicity, and improved manufacturability.

Description

        � � � � � The disclosed method is composed of five encapsulated or molded IC units placed on a cross-shaped layout flexible substrate (see Figure 1). Each IC unit has one or more silicon die vertically stacked. The two units from the x-axis of the design are then folded, followed by the folding of two units from y-axis of the design (see Figure 2). Pin outs or ball layout are located at the bottom of the center unit.

        � � � � � The method accommodates five or more silicon die vertically integrated in a single package. This approach minimizes handling at the die attach and wire bond process, due to enabling a one-step process. Likewise, it minimized wires crossing at wire-bond because the dice are laid out horizontally.

        � � � � � Moreover, the disclosed method provides the flexibility to combine different types of dice. It can also combine different die sizes, which has a minimal impact to manufacturability. Some advantages of handling different die sizes are:

•        � � � � Minimize die cracking at wirebond due to the springboard motion of a die overhang with 3-mil die thickness or less

•        � � � � Eliminating the requirement for a silicon spacer (see Figure 3)

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved productiv...