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Method for improving adhesion of silica filler particles to an epoxy dielectric matrix

IP.com Disclosure Number: IPCOM000009882D
Publication Date: 2002-Sep-25
Document File: 4 page(s) / 116K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for improving adhesion of silica filler particles to an epoxy dielectric matrix. Benefits include improved reliability and improved throughput.

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Method for improving adhesion of silica filler particles to an epoxy dielectric matrix

Disclosed is a method for improving adhesion of silica filler particles to an epoxy dielectric matrix. Benefits include improved reliability and improved throughput.

Background

� � � � � Silica filler particles present in an epoxy dielectric matrix tend to contaminate the vias. The contamination cannot be removed by the desmear and softech procedures conventionally used during preparation of the vias for plating. Failures of up to 20% of the substrates in reliability testing have been associated with this issue.

        � � � � � Conventionally, epoxy-terminated trimethoxy silane is used in the process (see Figure 1). Because it is hydrolyzed, it reacts with the hydroxy termination of the silica surface. Silane-coated silica is added to the epoxy matrix. The epoxy matrix contains a hardener (typically amine-terminated chemicals) that reacts with the epoxy functional groups during curing to create the cross-linking of the matrix. When the epoxy is cured, the hardener reacts with the epoxy-functional groups on the silane, anchoring the silica particles to the matrix.

        � � � � � With the use of epoxy-terminated silanes, the epoxy functional group in the silane must compete with the epoxy-functional groups in the matrix for the hardener. As a result, the chances are high for the epoxy functional group on the silane to remain unreacted with the hardener. The silica particles may not be anchored in the matrix. The m...