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Low Cost Design to Bulk Handle, Transport, or Store IC Components and/or Assembly Packages

IP.com Disclosure Number: IPCOM000009884D
Publication Date: 2002-Sep-25
Document File: 5 page(s) / 3M

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to protect IC components or assemblies during handling, storage and transport. Benefits include better component protection and reduced implementation costs.

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Low Cost Design to Bulk Handle, Transport, or Store IC Components and/or Assembly Packages

Disclosed is a method to protect IC components or assemblies during handling, storage and transport. Benefits include better component protection and reduced implementation costs.

Background

Existing technologies use injection molded trays (JEDEC style) that are one piece with a thermoformed closed bottom. Industry unloading practices for most components and assemblies is accomplished via manual handling. Components are loaded into JEDEC tray via automated equipment, but unloading is usually done by hand. JEDEC style trays require tray and component/assembly handling that results in finger contact on sensitive features.� The result is frequent damage to components or assemblies.

General Description

The disclosed method uses two trays, with only one tray required during line handling (see Figure 1). The location and combination of features will vary with component or assembly profile.� See Figures 2 through 6 for current state of the art and assembled and loaded configurations of the disclosed method.

When two trays are placed together (mated open face-to-face) 180 degrees rotated end-to-end, the protruding features of one are nested in corresponding pocket features on the opposing tray.� This configuration forms a complete box around the components/assemblies. Likewise, if the back face is mated to another back face, rotated 180 degrees to each other, the features on those faces nest in each other, allowing for multiple sets...