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Method for the use of press molds to create cavity features in thermoset dielectrics

IP.com Disclosure Number: IPCOM000009966D
Publication Date: 2002-Oct-02
Document File: 3 page(s) / 75K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the use of press molds to create cavity features in thermoset dielectrics. Benefits include improved functionality, improved ease of manufacturing, and improved reliability.

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Method for the use of press molds to create cavity features in thermoset dielectrics

Disclosed is a method for the use of press molds to create cavity features in thermoset dielectrics. Benefits include improved functionality, improved ease of manufacturing, and improved reliability.

Background

              To achieve the thinner packages required for small, thin applications, the stack height of substrate packages must be reduced.

      Conventionally, pads and die reside above the dielectric layer (see Figures 1 and 2). The use of solder resist defines the pad size.

General description

      The disclosed method is the creation of cavities in substrates through custom design press molds in thermoset dielectric lamination during the substrate build-up processes. Cavities in the dielectric are created for the pads and die to reside (see Figures 3 and 4).

 

      The key elements of the disclosed method include:

•             Substrate stack-up reduction with wirebond pads, bump pads, and a die residing in the cavity

•             Custom design of a press mold, pending substrate layout designs

•             No change to the overall current dielectric final thickness post lamination

•             Solder resist not required for this application because of nickel and gold plated pads

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to the improvement of the substrate and package overall stack-up height

•           ®..