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Asymmetrical Socket Body Size and Center Cavity

IP.com Disclosure Number: IPCOM000009970D
Publication Date: 2002-Oct-02
Document File: 3 page(s) / 246K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses an asymmetrical socket center cavity, landside caps, and motherboard caps for better placement of the die, and to accommodate an increased number of pins. Benefits include improved electrical signal routing and reducing packaging costs.

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Asymmetrical Socket Body Size and Center Cavity

Disclosed is a method that uses an� asymmetrical socket center cavity, landside caps, and motherboard caps for better placement of the die, and to accommodate an increased number of pins. Benefits include improved electrical signal routing and reducing packaging costs.

Background

The current process places the die parallel to the sides of the package, which does not leave room for short signal routing. If the die were rotated for shorter signal routing, the socket center cavity would also have to be rotated to match the die, due to the change in pin out.

An increased number of pins requires a larger socket; however, increasing the size of the socket decreases the overall real estate on the board (see Figure 1).

General Description

The disclosed method uses a socket center cavity that is any shape other than a square, with the edges parallel to the outer sides of the socket. Figure 2 illustrates a possible implementation of the disclosed method.� The socket also provides enough clearance to accommodate taller and higher density capacitors in the socket cavity on the motherboard as well as the package as illustrated in Figure 3.� The package cavity is molded similar to socket cavity to ensure adequate mating.�

Advantages

The following are advantages of the disclosed method:

 

  • Improves electrical signal routing
  • Optimizes board real estate
  • Reduces packaging costs

Fig. 1

Fig. 2

� Fig 3.

Disclosed Anonymously