Browse Prior Art Database

Apparatus for Determining Via Plug Fill Percent w/o use of X-section:

IP.com Disclosure Number: IPCOM000010022D
Publication Date: 2002-Oct-09
Document File: 2 page(s) / 487K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a coupon configuration to measure the fill percent of the plugging material in vias after the plugging process. Benefits include real-time measurements without taking a cross section.

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Apparatus for Determining Via Plug Fill Percent w/o use of X-section:

Disclosed is a method that uses a coupon configuration to measure the fill percent of the plugging material in vias after the plugging process. Benefits include real-time measurements without taking a cross section.

Background

Currently, there are two ways to measure the plugging material fill percent:

  • taking a cross-section
  • examining the color of the plug under a lamp.

Taking a cross section involves set up, plugging, curing the plug, cross sectioning the PCB, checking fill percent, and discarding an entire lot if the plugging is out of specifications; this process is labor-intensive and time-consuming.

Examination of color is extremely rough and subjective.� Results are wide and not always accurate.

General Description

The disclosed method uses a coupon configuration that allows direct measurement of the fill percent of the via plugging material. The coupon has equivalent PCB thicknesses and multiple via diameters located near a separation line; upon breaking, it reveals the via plugging material and a way to measure via fill percent.�

The disclosed method contains a V-groove or channel along the row of vias. Snapping the coupon off of the PCB will cause a break along the V-groove and through the barrels of the vias (at the weakest point), allowing for direct inspection of the via barrels (see Figures 1 and 2).

Advantages

The following are advantages of the disclosed method:

 

  • It is a quick and reliable me...