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Method for using KOH to clean scrubber PVA brushes

IP.com Disclosure Number: IPCOM000010023D
Publication Date: 2002-Oct-09
Document File: 3 page(s) / 74K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for using potassium hydroxide (KOH) to clean scrubber photovoltaic array (PVA) brushes. Benefits include improved performance, improved throughput, improved functionality, and improved quality.

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Method for using KOH to clean scrubber PVA brushes

 

Disclosed is a method for using potassium hydroxide (KOH) to clean scrubber photovoltaic array (PVA) brushes. Benefits include improved performance, improved throughput, improved functionality, and improved quality.

Background

              Dainippon Screen (DNS) 12-inch scrubbers conventionally use deionized (DI) water to clean the pencil brushes when idle (see Figure 1). The brushes are 0.75 inches at the point of contact with the wafer and get loaded with oxide particles very quickly. The early failure of the brushes imposes a quality risk issue unless frequent monitoring is performed on the machine (tool). Because DNS tools have a very fast run-rate (150 wafers per hour), any additional monitoring impacts the availability of the tool and its throughput. Consequently, more tools are required to run the factory. Additional monitoring requires additional technicians, defect metrology tools, and test wafers. Another drawback of unreliable brushes is that they must be changed frequently, which adds to the cost of consumable materials and increases tool downtime, impacting the schedule quality.

      The conventional method includes the following steps:

1.           DI water is used to clean the brushes in a brush refuge station.

2.           At failure, brushes are changed.

3.           The affected product wafers must be inspected and dispositioned on the defect metrology tools.

      One conventional solution is to cycle wafers offline to...