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Method for a surface-mount socket standoff gap

IP.com Disclosure Number: IPCOM000010068D
Publication Date: 2002-Oct-16
Document File: 2 page(s) / 75K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a surface-mount socket standoff gap. Benefits include improved performance and improved ease of implementation and manufacturing.

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Method for a surface-mount socket standoff gap

Disclosed is a method for a surface-mount socket standoff gap. Benefits include improved performance and improved ease of implementation and manufacturing.

Background

              Typical socket standoffs are designed to prevent uneven solderball collapse during reflow. The standoffs are used as load-carrying features during compressive loading.

      Surface-mount sockets are not subjected to large compressive loads. If large loads are required, alternative means to carry those loads are designed into other mechanisms, such as backing plates or retention mechanisms.

 

General description

              The disclosed method is a socket feature designed to control solderball collapse during reflow. Loading the socket under compression enables excess load to be diverted from the solderball joint to the socket-body standoffs. The gap between the standoff and the circuit board must be controlled to enable adequate solderball collapse but prevent excessive load through the solderball joint.

              The key element of the method includes a gap space between the socket body standoffs and the circuit board designed for clearance during reflow and minimal clearance during socket loading.

Advantages

              The disclosed method provides advantages, including:

•             Improved performance due to eliminating uneven solderball collapse during reflow

•             Improved ease of implementation and manufacturing due to not requiring the us...