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A Surface Mount Fixture and a New Method to Attach Surface Mount Components

IP.com Disclosure Number: IPCOM000010069D
Publication Date: 2002-Oct-16
Document File: 7 page(s) / 323K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method with the following two elements: · A process to attach surface mount components to any substrate, board, or package · A process to hold the surface mount components in place during the reflow process Benefits include placement of all surface mount components in a single process step instead of placing component individually, increasing throughput, reducing tombstoning, and reducing processing costs.

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A Surface Mount Fixture and a New Method to Attach Surface Mount Components

Disclosed is a method with the following two elements:

  • A process to attach surface mount components to any substrate, board, or package
  • A process to hold the surface mount components in place during the reflow process

Benefits include  placement of all surface mount components in a single process step instead of placing component individually, increasing throughput, reducing tombstoning, and reducing processing costs.

Background

Currently, reels of surface mount components are placed in “pick and place” feeders. A high-speed chip-shooter picks up each surface mount component individually, and places each in series on a substrate, board, or package. Placing each component singly decreases throughput as the component count increases.

Figure 1 shows the current state of the art in surface mount technologies. Surface mount components are loaded into the “pick and place” machines like the FCMII via tape and reel. The FCMII advances the tape and reel through a feeder, and a vacuum nozzle picks components from the tape and reel and places them onto a substrate, board, or package prior to the reflow process.

General Description

The disclosed method uses the following process to place surface mount components:

  1. Components are obtained in bulk packaging (see Figure 2).
  2. Components are placed into a bulk feeder (see Figure 3).
  3. Components are preloaded into a component fixture (see Figure 4). Components are agitated into the fixture; in cases where differing sizes of components are required, the fixture (which contains varying slot sizes) agitates starting with larger sizes, then
    smaller sizes.
  4. A press pushes the components into their respective locations in the fixture. The press also serves to level the components into the fixture (see Figure 5).
  5. A placement device picks up the fixture containing the components, and places the fixture/components combination onto the substrate, board, or package (see Figure 6).
  6. The fixture/component/substrate combination is placed into reflow ovens where the fixture ensures that “tombstoning” or “billboarding” does not occur.
  7. A placement device removes the fixture from the fixture/component/substrate combinatio...