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Method for an apparatus for reducing impedance in PWBs

IP.com Disclosure Number: IPCOM000010087D
Publication Date: 2002-Oct-17
Document File: 3 page(s) / 2M

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an apparatus for reducing impedance in printed wire boards (PWBs). Benefits include improved performance.

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Method for an apparatus for reducing impedance in PWBs

Disclosed is a method for an apparatus for reducing impedance in printed wire boards (PWBs). Benefits include improved performance.

Background

        � � � � � The conventional dog-bone via ball-grid array (BGA) pattern (see Figure 1) results in higher impedance and voltage drop across the BGA grid compared to the via-in-bar method (see Figure 2).

Description

        � � � � � The disclosed method is an apparatus for reducing impedance in PWBs. Creating a via in a bar reduces impedance across a BGA grid using a ganged solder-ball structure. Vias connect to printed circuit board (PCB) inner layers located in the ganged solder bar (see Figure 3). The voltage drop is minimized across the BGA structure by moving the vias into the bar (see Figure 4). This approach frees the interstitial area between the bars for greater current flow, effectively increasing the area and reducing the resistivity. The via-in-bar case showed a 48% drop in plane resistivity compared to the dog-bone via case.

� � � � � Vias may be plugged on the secondary or the primary side.

Advantages

        � � � � � The disclosed method provides advantages, including improved performance due to improved impedance, resistivity and voltage drop.

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Disclosed anonymously