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Method for Incorporating Passive Components into FSBGA and Asymmetric FSBGA Folded (Stackable) Ball Grid Array Packages

IP.com Disclosure Number: IPCOM000010108D
Publication Date: 2002-Oct-23
Document File: 3 page(s) / 164K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for attaching passive components (e.g. capacitors, inductors, resistors, etc.) in two areas: · For FSBGA packages, into the area folded together · For asymmetric FSBGA packages, onto the asymmetric flap Benefits include keeping components out of the way and closer to the die in the folded package.

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Method for Incorporating Passive Components into FSBGA and Asymmetric FSBGA Folded (Stackable) Ball Grid Array Packages

Disclosed is a method for attaching passive components (e.g. capacitors, inductors,

resistors, etc.) in two areas:

 

  • For FSBGA packages, into the area folded together
  • For asymmetric FSBGA packages, onto the asymmetric flap

Benefits include keeping components out of the way and closer to the die in the folded package.

Background

Currently passives are put on the packages stacked on top that are not folded, but there are no plans to put passives on the folded package.

General Description

The disclosed method places passive components in the vicinity of the die and fold, while taking up very little space. The passives are placed differently, depending on the type of package:

 

  • For FSBGA packages. Solder paste is applied on opposing inside folds on the contact pads, then the passives are mounted to the appropriate contact pad on one side of the folded package (see Figure 1). The package is then folded so that the passives reflow will be connected to the contact pads on both sides of the fold (see final configuration in
    Figure 1). Multiple terminal passives and multiple passives per folded package
    may be used.
  • For asymmetric FSBGA packages. Solder paste is applied on the longer fold on the contact pads, then the passives are placed on the appropriate contact pads (see Figure 2). The entire assembly is then put through a reflow process to secure the passives in place...