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Integration of discrete component in printed circuit boards

IP.com Disclosure Number: IPCOM000010158D
Original Publication Date: 2002-Oct-29
Included in the Prior Art Database: 2002-Oct-29
Document File: 2 page(s) / 25K

Publishing Venue

Motorola

Related People

Reiner Bingel: AUTHOR [+2]

Abstract

The trend to increase the density of printed circuit boards is still ongoing. To integrate electronic components into printed circuit boards is no new topic, but until now it has not been significant for general applications. There are many reasons why this will change in the future.

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Integration of discrete component in printed circuit boards

Reiner Bingel &  Hans-Peter Gärtner

Abstract

The trend to increase the density of printed circuit boards is still ongoing. To integrate electronic components into printed circuit boards is no new topic, but until now it has not been significant  for general applications. There are many reasons why this will  change in the future.

·   The tendency to use more termination resistors because of higher frequencies.

·   The necessity of smaller products.

·   New technologies allow much smaller component value tolerances.

 
Introduction

The goal is to integrate both passive and active elements into a printed circuit board. The required space and the weight of an electronic assembly may be reduced significantly, and the RF characteristics can be improved.

Resistors, capacitors and chips in general are applied to an inner layer of a printed circuit board, and will be laminated by an SBU (Sequential Build Up) process. The pads of the devices are contacted from the outer layers with blind vias. This contacting method has some disadvantages. It requires space, restricts the layout possibilities and is cost intensive.

Solution

Components with solder depot. 

A much better connection of the components could be established if a solder depot was added directly to the pads. The parts with this solder depot are placed and laminated into the printed circuit board. The contacting will be achieved during this laminating and tempering process...