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Method for eliminating the requirement for wirebonding over PI/BCB layers during wirebond in a wirebond-to-wirebond RDL application

IP.com Disclosure Number: IPCOM000010169D
Publication Date: 2002-Oct-30
Document File: 3 page(s) / 40K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for eliminating the requirement for wirebonding over polymide/benzocyclobutene (PI/BCB) layers during wirebond in a wirebond-to-wirebond redistribution layer (WB-WB RDL) application. Benefits include improved ease of manufacturing.

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Method for eliminating the requirement for wirebonding over PI/BCB layers during wirebond in a wirebond-to-wirebond RDL application

Disclosed is a method for eliminating the requirement for wirebonding over polymide/benzocyclobutene (PI/BCB) layers during wirebond in a wirebond-to-wirebond redistribution layer (WB-WB RDL) application. Benefits include improved ease of manufacturing.

Background

        � � � � � The conventional application of WB-WB RDL to wafers requires that wirebonding for the RDL pads be done over soft surfaces, such as PI/BCB (see Figure 1). The soft underlying surface causes poor wirebond adhesion, such as poor wirebond pull test and ball shear. No conventional solution exists.

� � � � � The WB-WB application requires that existing wirebond pads be relocated on the wafer. One experimental solution is creating the new wirebond pads on top of the RDL and PI passivation layers.

Description

� � � � � The disclosed method is a novel processing sequence in creating the RDL wirebond pads so that they bond on the original oxynitride passivation layer (see Figure 2). The method eliminates the issues/problems associated with the conventional method of wirebonding over soft surfaces.

� � � � � The disclosed method creates wirebond pads for RDL so that they bond to a hard oxynitride passivation layer. This approach requires an additional masking step to protect the wirebond locations because the oxynitride layer cannot be etched through at the pad locations.

� � � � � The...