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Method for eliminating the requirement for wirebonding over PI/BCB layers during wirebond in a wirebond-to-wirebond RDL application

IP.com Disclosure Number: IPCOM000010169D
Publication Date: 2002-Oct-30
Document File: 3 page(s) / 88K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for eliminating the requirement for wirebonding over polymide/benzocyclobutene (PI/BCB) layers during wirebond in a wirebond-to-wirebond redistribution layer (WB-WB RDL) application. Benefits include improved ease of manufacturing.

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Method for eliminating the requirement for wirebonding over PI/BCB layers during wirebond in a wirebond-to-wirebond RDL application

Disclosed is a method for eliminating the requirement for wirebonding over polymide/benzocyclobutene (PI/BCB) layers during wirebond in a wirebond-to-wirebond redistribution layer (WB-WB RDL) application. Benefits include improved ease of manufacturing.

Background

              The conventional application of WB-WB RDL to wafers requires that wirebonding for the RDL pads be done over soft surfaces, such as PI/BCB (see Figure 1). The soft underlying surface causes poor wirebond adhesion, such as poor wirebond pull test and ball shear. No conventional solution exists.

      The WB-WB application requires that existing wirebond pads be relocated on the wafer. One experimental solution is creating the new wirebond pads on top of the RDL and PI passivation layers.

Description

      The disclosed method is a novel processing sequence in creating the RDL wirebond pads so that they bond on the original oxynitride passivation layer (see Figure 2). The method eliminates the issues/problems associated with the conventional method of wirebonding over soft surfaces.

      The disclosed method creates wirebond pads for RDL so that they bond to a hard oxynitride passivation layer. This approach requires an additional masking step to protect the wirebond locations because the oxynitride layer cannot be etched through at the pad locations.

      The...