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Method for a carrier to protect pinned products during internal and external transport

IP.com Disclosure Number: IPCOM000010176D
Publication Date: 2002-Oct-30
Document File: 6 page(s) / 256K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a carrier to protect pinned products during internal and external transport. Benefits include improved reliability and improved productivity.

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Method for a carrier to protect pinned products during internal and external transport

Disclosed is a method for a carrier to protect pinned products during internal and external transport.  Benefits include improved reliability and improved productivity.

Background

              Component damage can occur during loading, storage, transport, and unloading of integrated circuit (IC) components or assemblies.

              Existing technologies include the use of injection molded, Joint Electronic Devices Engineering Council (JEDEC) style trays that are injection molded in one piece or are a thermoformed closed-bottom style. Industry unloading practices for most components and assemblies is accomplished via manual handling. Components may be loaded into a JEDEC tray via automated equipment, but unloading might be done by hand. JEDEC style trays require tray and/or component/assembly handling that results in finger contact with the component or assembly’s sensitive features. The result may be that unacceptable damage occurs to components or assemblies.

      Although the thermoformed tray provided functional improvements, the access for removal is not improved and product is very difficult to remove manually (see Figure 1).

General description

              The disclosed method is a low-cost design and method to protect pins on IC components or assemblies during handling, storage, and transport.

              The key elements of the method include:

•             A one-piece injection molded carrier designed so that when a component or assembly is inserted, it remains in place due to friction on the assembly (see Figure 2).

•             When two or more carriers are stacked, they intercept each other along the perimeters to form a semi-complete enclosure around the components contained inside.

•             A set of features interlocks the carriers when they are stacked and banded (see Figure 3). The features prevent two trays from shifting excessively in relation to each other. Horizontal restraint is provided by the outer pack during transport and storage.

•             A set of features maintains...