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Method for a package landside and motherboard cap clearance socket

IP.com Disclosure Number: IPCOM000010177D
Publication Date: 2002-Oct-30
Document File: 2 page(s) / 64K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a package landside and motherboard cap clearance socket. Benefits include improved electrical performance and improved ease of manufacturing.

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Method for a package landside and motherboard cap clearance socket

Disclosed is a method for a package landside and motherboard cap clearance socket. Benefits include improved electrical performance and improved ease of manufacturing.

Description

� � � � � The disclosed method is a CPU socket that provides sufficient clearance to accommodate taller and higher-density capacitors in the socket cavity on the motherboard and package (see Figure 1). This solution is achieved by changing the socket height while maintaining the same length and width.

� � � � � The disclosed method improves electrical performance by enabling higher-density cost-effective capacitors in the socket cavity (see Figure 2) and/or under the package (see Figure 3).

� � � � � The use of higher-density capacitors reduces the number of capacitors required and enables the use of one size of capacitor for the entire board, improving beat rate and board through-put time.

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved electrical performance due to the use of higher-density capacitors

•        � � � � Improved ease of manufacturing due to improved beat rate and board throughput because of the use of one size of capacitor for the entire board

•        � � � � Improved cost effectiveness due to the use of single type of lower-cost capacitor

Fig. 1

Fig. 2

Fig. 3

Disclosed anonymously