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Method for a package landside and motherboard cap clearance socket

IP.com Disclosure Number: IPCOM000010177D
Publication Date: 2002-Oct-30
Document File: 2 page(s) / 67K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a package landside and motherboard cap clearance socket. Benefits include improved electrical performance and improved ease of manufacturing.

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Method for a package landside and motherboard cap clearance socket

Disclosed is a method for a package landside and motherboard cap clearance socket. Benefits include improved electrical performance and improved ease of manufacturing.

Description

      The disclosed method is a CPU socket that provides sufficient clearance to accommodate taller and higher-density capacitors in the socket cavity on the motherboard and package (see Figure 1). This solution is achieved by changing the socket height while maintaining the same length and width.

      The disclosed method improves electrical performance by enabling higher-density cost-effective capacitors in the socket cavity (see Figure 2) and/or under the package (see Figure 3).

      The use of higher-density capacitors reduces the number of capacitors required and enables the use of one size of capacitor for the entire board, improving beat rate and board through-put time.

Advantages

              The disclosed method provides advantages, including:

•             Improved electrical performance due to the use of higher-density capacitors

•             Improved ease of manufacturing due to improved beat rate and board throughput because of the use of one size of capacitor for the entire board

•             Improved cost effectiveness due to the use of single type of lower-cost capacitor

Fig. 1

Fig. 2

Fig. 3

Disclosed anonymously