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Stamped Array Metal Core for HDI Substrates

IP.com Disclosure Number: IPCOM000010181D
Publication Date: 2002-Oct-30
Document File: 3 page(s) / 140K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a metal core (for CPU and other HDI organic substrates) with a standard punched array of holes. The holes of the metal core are positioned to provide complete flexibility for a multitude of routing designs using the same core.

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Stamped Array Metal Core for HDI Substrates

Disclosed is a method for a metal core (for CPU and other HDI organic substrates) with a standard punched array of holes. The holes of the metal core are positioned to provide complete flexibility for a multitude of routing designs using the same core.

Background

Because there are many discrete designs for substrates, substrates that use a metal core typically require that the core is custom etched for each design to provide through holes to enable VIV like formation. Currently, this etching process produces very irregular and non-repeatable geometries which impact the performance and reliability of the substrate (and the packaged product).� This etching process is also inherently expensive since it is time consuming and the equipment uses large amounts of floor space.�

Metal stamping requires expensive dies for each custom application, but generally produces more precise geometries.

General Description

The disclosed method uses a patterned matrix stamped on the metal core (see Figure 1). The pattern of holes is as dense as possible under the “die shadow” area to allow for direct routing, and to enable easy “fan out” of the dense signals in this area. On the perimeter, the pattern is less dense to improve the rigidity and structural handling of the metal core substrate.� The individual metal core substrates may be initially processed in a larger panel of several substrates (i.e. in a matrix pattern themselves). An enlarged...