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Cost Reduction Using Vertical Tie-Bar Clips

IP.com Disclosure Number: IPCOM000010211D
Publication Date: 2002-Nov-06
Document File: 6 page(s) / 87K

Publishing Venue

The IP.com Prior Art Database

Abstract

Improvement in the electrical resistance of semiconductor packages can be improved by using a clip in place of wire bonds (see Figure 1)

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Cost Reduction Using Vertical Tie-Bar Clips

Improvement in the electrical resistance of semiconductor packages can be improved by using a clip in place of wire bonds (see Figure 1)

Key Words: Tie-bar, clips, lead-frame

                                                   Figure 1

Reducing the cost of processing clips may be achieved through two methods.  One method is by increasing the number of clips per unit length of frame.  And a second method is reducing the clearance between the tie-bar edge and the side of the package, thereby providing more clearance and permitting a smaller package size.

The cost of the clip fabrication can be broken into material cost and stamping cost.  The material itself contributes the majority of the clip cost.  This means a denser clip distribution within a fixed length will provide a less expensive clip unit cost.  By increasing the number of clips per frame length, the design of a vertical tie bar clip frame will reduce the cost substantially.

Clips are attached in frame form and packed on a reel.  The reel feeding direction with reference to the clip orientation is 90 degrees.  The reel feeding direction may be either parallel or perpendicular for a pick and place machine that use either Linear or Rotation pick-up head (Figure 2).

FIGURE 2

Figure 3 illustrates the protruding horizontal tie bar after cutting, thereby reducing the gap or clearance between the tie-bar edge and the side of the package.

                                                               

FIGURE 3

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