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Method for a land pattern for a paste-in-hole application of a 1X hybrid connector

IP.com Disclosure Number: IPCOM000010214D
Publication Date: 2002-Nov-06
Document File: 2 page(s) / 295K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a land pattern for a paste-in-hole application of a 1X hybrid connector. Benefits include improved ease of manufacturing.

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Method for a land pattern for a paste-in-hole application of a 1X hybrid connector

 

Disclosed is a method for a land pattern for a paste-in-hole application of a 1X hybrid connector. Benefits include improved ease of manufacturing.

Background

              Conventionally, a 1X hybrid component is soldered to a printed circuit board in two steps, reflowing the surface-mount technology (SMT) signal leads and wave soldering the shield leads. A requirement exists for this process to occur in a single step.

Description

              The disclosed method is a printed circuit board land pattern that enables paste-in-hole soldering of a 1X hybrid connector. This approach eliminates the wave soldering of the shield leads, simplifying the manufacturability of printed circuit board (PCB) assembly using this component.

              The disclosed method increases the land pattern surface areas around shield lead holes, enabling an additional volume of solder paste to be placed on the board. The additional solder is required to flow into the shield lead holes to ensure adequate solder fill. This paste-in-hole processing eliminates the requirement to wave solder the shield leads, eliminating one process step.

              The 1X hybrid connector paste-in-hole land pattern is rectangular areas around the shield lead holes (see Figure 1).  The size matching with a proper gap between the pins and the holes is to ensure solder joints forming quality and the machine placability of the components onto a boar...