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Method for a socket-T LGA contact cover

IP.com Disclosure Number: IPCOM000010215D
Publication Date: 2002-Nov-06
Document File: 3 page(s) / 83K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a socket-T land-grid array (LGA) contact cover. Benefits include improved reliability.

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Method for a socket-T LGA contact cover

Disclosed is a method for a socket-T land-grid array (LGA) contact cover. Benefits include improved reliability.

Background

              LGA contact causes damage during the handling and shipping of a motherboard-mounted socket. Historical shipping data common to fragile CPU-related components indicates a fallout rate of ~12,000 defects per million (DPM).

              Currently, mPGA sockets, by having an interfacing surface (top cover) allow for the use of polyimide tape to cover the subsurface contacts (see Figure 1). Pick-and-place covers are also viable as long term protection of the socket contacts as the contacts are contained within the socket body. Furthermore, micro pin-grid array (mPGA) sockets have no structural components in close contact with the sides of the socket.

      The LGA socket design uses spring contacts that are contoured 3-dimensional surfaces to ensure electrical connection with the CPU package pads. The contacts cannot be protected in the conventional sense with the use of polyimide tape. Pick-and-place covers interfere with both the motherboard functional test process and the DSL components.

 

General description

              The disclosed method is an injection-molded component (part) used to protect LGA socket contacts from handling and shipping damage.

              The key elements of the method include:

•             Slight interference fit common to direct socket loading (DSL) load plate integrated heat spreader (IHS) opening for retention

•             Finger tab for aid in removal from DSL load plate

•             Perimeter lip to prevent over-insertion

Advantages

 

              The disclosed method provides advantages, including:

•             Improved reliability due to defect reduction

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