Browse Prior Art Database

Single Plate Carrier With Sunk Substrate Registration

IP.com Disclosure Number: IPCOM000010217D
Publication Date: 2002-Nov-06
Document File: 3 page(s) / 94K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a single plate metal processing carrier with formed substrate retention tabs to provide registration below the main carrier plate. Benefits include improving assembly precision and reducing production costs.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 68% of the total text.

 

Single Plate Carrier With Sunk Substrate Registration

Disclosed is a method that uses a single plate metal processing carrier with formed substrate retention tabs to provide registration below the main carrier plate. Benefits include improving assembly precision and reducing production costs.

Background

Metal carriers are used in processing semiconductor packages.� Each carrier contains numerous pockets (e.g. 8,10, or 12 pockets) in which packages are loaded using an Automatic Part Loader for high-volume production, or with a manual part loader for low volume production (i.e. design of experiments testing). The parts are restrained in the carrier by the force supplied from the e-spring.

Currently, substrates are constrained using a three-layer assembly consisting of a bottom plate, a top plate, and e-springs (see Figure 1). The top plate and e-springs are welded to the bottom plate using either resistance or laser welding. The aperture in the top plate is larger than the aperture in the bottom plate, creating a ledge for support and a pocket to place the substrate. The e-spring exerts a force on the substrate to hold it in the pocket during the assembly process (see Figure 2).

General Description

The disclosed method consists of a formed stainless steel plate with springs welded along the carrier centerline to retain the substrate in pocket (see Figure 3). This carrier design restrains the substrates without the need of additional welded components (see Figure 4).� Formed fe...