Browse Prior Art Database

Bi-Directional Heat Transfer Transponder

IP.com Disclosure Number: IPCOM000010218D
Publication Date: 2002-Nov-06
Document File: 2 page(s) / 329K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that dissipates heat through the bottom and sides of the transponder heat sink, rather than only through the top in a local area. Benefits include meeting performance guidelines at high temperatures.

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Bi-Directional Heat Transfer Transponder

Disclosed is a method that dissipates heat through the bottom and sides of the transponder heat sink, rather than only through the top in a local area. Benefits include meeting performance guidelines at high temperatures.

Background

Currently, heat sink designs used with past generations of transponders do not meet performance guidelines at high temperatures.

General Description

Since the serdes (which has the highest dissipation power in the transponder) is located near the transmit laser and the receive optics assembly, it is essential to transfer heat away from this area.

To accomplish this, heat is transferred in two ways:

 

  • An elastic heat transfer material is compressed between the serdes IC and the heat sink to transfer heat through the top.
  • A PCB design (consisting of multiple ground layers of copper) transfers heat to the sides and bottom, away from the serdes.

The PCB is “stapled” with vias to tie all of the ground planes locally, and provide a low resistant thermal contact. The heat transfer to the bottom of the transponder is achieved by placing the heat transfer material between the PCB and the pedestal. The heat transfer to the side of the transponder is performed by the inner copper ground planes to the edge of the PCB, which is side plated. The edge of the PCB board is compressed, and contacts the upper and lower half of the two-part heat sink (see Figures 1 and 2). 

Advantages

The total surface area of the transpond...