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High Performance Thermal Interface Material Tester

IP.com Disclosure Number: IPCOM000010221D
Publication Date: 2002-Nov-06
Document File: 3 page(s) / 259K

Publishing Venue

The IP.com Prior Art Database

Abstract

The disclosed method is a test station used to measure the properties of a Thermal Interface Material (TIM). Benefits include outstanding measurement precision and a large testing temperature range.

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High Performance Thermal Interface Material Tester

The disclosed method is a test station used to measure the properties of a Thermal Interface Material (TIM). Benefits include outstanding measurement precision and a large testing temperature range.

Background

Currently, a single-position fixture and custom copper blocks are used to contain the TIM and conduct heat across it (see Figure 1). The limitations of the current state of the art are as follows:

 

  • Limited thermal resolution, pressure, and programmability.
  • High cost and low thru-put time.
  • Inability of the tester to characterize different classes of TIM technology such as Gels, Solders, and Polymer-Solder Hybrids.

General Description

All of the mechanical components of the disclosed method have preformed as expected and without permanent deformation during all testing to date (~100 tests run so far).  Figure 2 shows the central portion of the disclosed method fully assembled during a test. All of the main mechanical components (i.e., cooling block, heating block, block bolts) were analyzed to ensure that they would not deform during operation (see Figure 3). Safety factors for all components were well over 1 (min=1.7). The predicted stress for the cooling block (56 MPa) was well below the aluminum yield point (97 MPa).

The following are the primary components of the disclosed method:

 

  • Load Frame – used to apply a controlled pressure to the test specimen.
  • Hot Side Assembly – used to apply a controlled heating to the te...