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INTERLOCKING FRAME AND SLIDE-ON COVER FOR ELECTRONICS ENCLOSURE

IP.com Disclosure Number: IPCOM000010248D
Publication Date: 2002-Nov-13
Document File: 2 page(s) / 471K

Publishing Venue

The IP.com Prior Art Database

Related People

Mike W. Toana: INVENTOR [+2]

Abstract

A method and apparatus, according to the principles of the invention, creates an electrical contact for EMI suppression of an electronics enclosure by retaining the front edge of a slide?on cover.

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INTERLOCKING FRAME AND SLIDE-ON COVER

FOR ELECTRONICS ENCLOSURE

              A method and apparatus, according to the principles of the invention, creates an electrical contact for EMI suppression of an electronics enclosure by retaining the front edge of a slide‑on cover.

              The cover is placed onto the frame (see Figures 1 and 2) from the top or rear of the unit (see Figures 3 and 4).  As the cover is slid forward to the final assembly position, the front flange of the cover slides beneath hooks/catches stamped into the front flange of the frame (see Figures 5 and 6), creating pressure between the cover and the frame.  The cover is also trapped and is not free to move.  Bumps may be added to either part to create the electrical contact points for the EMI enclosure.

   

                                 Frame                                                              Detail of Flange

                                Figure 1                                                                   Figure 2

   

           Frame and Cover Before Assembly                                  Detail Before Assembly

                                Figure 3                                                                   Figure 4

   

            Frame and Cover After Assembly              ®..