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Method for uniformed cooling of substrates after a molding process for warpage elimination

IP.com Disclosure Number: IPCOM000010250D
Publication Date: 2002-Nov-13
Document File: 2 page(s) / 28K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for uniformed cooling of substrates after a molding process for warpage elimination. Benefits include improved reliability.

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Method for uniformed cooling of substrates after a molding process for warpage elimination

Disclosed is a method for uniformed cooling of substrates after a molding process for warpage elimination. Benefits include improved reliability.

Background

        � � � � � Substrate panel warpage can occur during the molding process. Conventionally, this problem is addressed with process input-parameter optimization using the following:

•        � � � � Statistical tools

•        � � � � Molding compound reformulation

•        � � � � Substrate and mold compound material properties interaction optimization

•        � � � � Mold die tooling redesign

        � � � � � Heat transfer (object cooling) starts with convection from the outer layers of the mass. Cooling continues to the inner layers through conduction. The outer-most layers cool first, and the inner-most layers cool later. From material science in molecular behavior during cooling, a mass contracts a significant amount during cooling. Deformation occurs when uniform contraction in the surfaces of the mass does not occur. This deformation in the surfaces is the phenomenon called panel warpage.�

General description

� � � � � The disclosed method uses equipment that cures the molded substrates with uniform cooling to eliminate panel warpage in manufacturing application protocol (MAP) assembly.

� � � � � The key elements of the method include:

•        � � � � Spot heaters

•        � � � � Spot coolers

•        � � � � Temperature mix time controller

•        � � � � Enclosed space

A...