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Method for uniformed cooling of substrates after a molding process for warpage elimination

IP.com Disclosure Number: IPCOM000010250D
Publication Date: 2002-Nov-13
Document File: 2 page(s) / 53K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for uniformed cooling of substrates after a molding process for warpage elimination. Benefits include improved reliability.

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Method for uniformed cooling of substrates after a molding process for warpage elimination

Disclosed is a method for uniformed cooling of substrates after a molding process for warpage elimination. Benefits include improved reliability.

Background

              Substrate panel warpage can occur during the molding process. Conventionally, this problem is addressed with process input-parameter optimization using the following:

•             Statistical tools

•             Molding compound reformulation

•             Substrate and mold compound material properties interaction optimization

•             Mold die tooling redesign

              Heat transfer (object cooling) starts with convection from the outer layers of the mass. Cooling continues to the inner layers through conduction. The outer-most layers cool first, and the inner-most layers cool later. From material science in molecular behavior during cooling, a mass contracts a significant amount during cooling. Deformation occurs when uniform contraction in the surfaces of the mass does not occur. This deformation in the surfaces is the phenomenon called panel warpage. 

General description

      The disclosed method uses equipment that cures the molded substrates with uniform cooling to eliminate panel warpage in manufacturing application protocol (MAP) assembly.

      The key elements of the method include:

•             Spot heaters

•             Spot coolers

•             Temperature mix time controller

•             Enclosed space

A...