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Electroless Cobalt Plating Bath Regen Process and Integrated System

IP.com Disclosure Number: IPCOM000010328D
Publication Date: 2002-Nov-20
Document File: 2 page(s) / 84K

Publishing Venue

The IP.com Prior Art Database

Abstract

The disclosed method is a bath regen process used to accomplish electroless cobalt plating. Benefits include reduced defects, wafer to wafer non-uniformity, chemical and waste disposal costs.

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Electroless Cobalt Plating Bath Regen Process and Integrated System

The disclosed method is a bath regen process used to accomplish electroless cobalt plating. Benefits include reduced defects, wafer to wafer non-uniformity, chemical and waste disposal costs.

Background

Currently, no bath regen exists, and electroless cobalt particles are generated in the plating bath due to a short bath life. Electroless cobalt particles are deposited on the wafer surface, causing significant leakage between copper lines. No closed loop integrated thin film metrology exists to measure film thickness, which results in a large wafer to wafer non-uniformity.

Presently the bath life is limited to resolve electroless cobalt particles generation. However, frequent bath change increases chemical costs, decreases tool availability, and increases hazardous waste generation and waste disposal costs.

General Description

The disclosed method contains the following elements:

 

  • An electroless plater including: deposition cells, pre-treat and post-treat cells, SRD/EBR, anneal, wafer handling parts, automation/electrical units, and a bath module with two or more tanks
  • A regen unit with electroless bath storage tanks for cooling, filtering, and recirculation/treatment capabilities (such as acidification or adsorption).
  • An electroless plating bath dosing/metro unit

The following steps describe the electroless cobalt plating bath regen process (see Figure 1):

 

  1. Collect the electroless plating bath in off-line sto...