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Solder Mask Design for Improving BGA Performance

IP.com Disclosure Number: IPCOM000010570D
Publication Date: 2002-Dec-18
Document File: 3 page(s) / 181K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a solder mask design to bridge the balls in the BGA plane areas of a PCB. Benefits include a controlled method for bridging multiple balls together by altering the solder mask.

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Solder Mask Design for Improving BGA Performance

Disclosed is a method that uses a solder mask design to bridge the balls in the BGA plane areas of a PCB. Benefits include a controlled method for bridging multiple balls together by altering the solder mask.

Background

Currently, BGA devices all have separate (individual) balls. When more power is required, or a thermal path needs to be established, individual balls are added to the design. The reliability of each ball’s solder joint is independent from the balls around it.

By bridging multiple balls together the strength and reliability of the BGA solder joints is increased.� � This can be achieved through modification of the solder mask.

General Description

The disclosed method alters the solder mask to expose the outer layer circuitry in the area where bridging is desired, allowing the solder to bridge during reflow. This is a common occurrence when the solder mask is missing, mis-registered, or insufficient solder mask dams are present.� The disclosed method controls these conditions by designing the solder mask to purposely bridge solder balls in select areas (see Figures 1 through 4).

Advantages

The following are advantages of the disclosed method:

 

  • Defines a method for bridging multiple balls together by altering the solder mask.
  • Can be used in conjunction with other gang solder solutions, which can improve current carrying capacity and heat dissipation.

 

  • Modified solder mask controls the size and shape of the bridged...