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Method for a wafer-flipper cassette

IP.com Disclosure Number: IPCOM000010573D
Publication Date: 2002-Dec-18
Document File: 3 page(s) / 176K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a wafer-flipper cassette. Benefits include improved functionality and improved reliability.

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Method for a wafer-flipper cassette

Disclosed is a method for a wafer-flipper cassette. Benefits include improved functionality and improved reliability.

Background

        � � � � � The spacerless stacked chip scale package (SCSP) die preparation process requires a wafer-flipping module process. This module is responsible for flipping the wafer and mounting it on a mounting tape (topside down) with a wafer frame, then feeding the flipped wafer to a wafer saw process.

        � � � � � Conventionally, the wafers are removed from the standard wafer cassette and manually flipped to another wafer cassette for processing with the next top-side mounting module (see Figure 1). This procedure can cause wafer damage (such as cracking) because the wafer thickness is only 7 mils (0.1778 mm).

General description

        � � � � � The disclosed method is a wafer cassette modified for wafer-flipping applications during the die preparation process on the SCSP-SE program.

        � � � � � The key elements of the method include:

•        � � � � Wafer cassette with mirrored top and bottom parts

•        � � � � Wafer slot that has an additional holder for thin wafers

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved functionality due to the capability to be used with all wafer-flipping modules without manually loading and unloading the wafers to different cassettes

•        � � � � Improved functionality due to a wafer holder feature, which adds support and prevents wafers from moving inside...