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Method for designing a multi-dielectric capacitor

IP.com Disclosure Number: IPCOM000010576D
Publication Date: 2002-Dec-18
Document File: 3 page(s) / 111K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a design method for a multidielectric capacitor. Benefits include improved reliability and improved cost effectiveness.

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Method for designing a multi-dielectric capacitor

Disclosed is a design method for a multidielectric capacitor. Benefits include improved reliability and improved cost effectiveness.�

Background

        � � � � � Ceramic capacitor technology is widely used in the electronics industry. Manufacturing costs have increased due to the high attach rates of different types of capacitors.

        � � � � � The conventional solution is placing additional capacitors manufactured with different dielectric materials (see Figure 1).

        � � � � �

Description

� � � � � The disclosed method is a multicapacitor component built with two or more different dielectric materials (see Figure 2). Variation in capacitance due to temperature can be compensated by the properties of each of the dielectric materials and the specific substrate interconnects design.

        � � � � � The key elements of the method include:

•        � � � � Two or more dielectric materials

•        � � � � Two or more capacitors per component

        � � � � � Appropriate substrate interconnects enable two or more capacitors to interact and provide enough capacitance to compensate for capacitance losses associated with different dielectric material performance over temperature.

        � � � � � The disclosed method requires the� capacitor to be separated internally into two or more capacitors. Existing lamination/casting technologies can be used. However, the difference lies in the stack up process where two or more dielectric materials are used side by side or stacked (see...