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Method for an improved coin-stack feeder to avoid part nesting of microelectronic package heatsinks

IP.com Disclosure Number: IPCOM000010578D
Publication Date: 2002-Dec-18
Document File: 4 page(s) / 93K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an improved coin-stack feeder to avoid part nesting of microelectronic package heatsinks. Benefits include improved reliability.

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Method for an improved coin-stack feeder to avoid part nesting of microelectronic package heatsinks

Disclosed is a method for an improved coin-stack feeder to avoid part nesting of microelectronic package heatsinks. Benefits include improved reliability.

Background

        � � � � � Conventionally, higher power flip-chip microelectronic packages require an integrated heatsink (IHS) to help dissipate heat between the silicon and chip and mechanically protect the chip. In future, packages are expected to require a stepped IHS design with a taper on the surface of the lid. Due to the stepped IHS design, the possibility exists that legacy shipping media may enable the tapered design to bind, causing jams when the media is loaded into an automated tool. It uses the same shipping tube as the feed to the machine for placing the lid onto the bare microelectronic package (see Figure 1). A high probability exists that during shipping the tapered lids will shift due to minimal contact area with the legacy media design, causing exterior damage to the lids (see Figure 2).

        � � � � � A coin-stack feeder the shape of a square cross-section is used with the lids oriented in the same direction (see Figure 3).

Description

        � � � � � The disclosed method is an improved coin-stack feeder that avoids part nesting of microelectronic package heatsinks. The method staggers the lids using a star shaped cross-section for the coin-stack feeder, which does not allow the IHS lids to bind (see Figure 4). Additiona...