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Method for a solder-lock retention fastener

IP.com Disclosure Number: IPCOM000010579D
Publication Date: 2002-Dec-18
Document File: 3 page(s) / 86K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a solder-lock retention fastener. Benefits include improved performance and improved reliability.

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This is the abbreviated version, containing approximately 75% of the total text.

Method for a solder-lock retention fastener

Disclosed is a method for a solder-lock retention fastener. Benefits include improved performance and improved reliability.

Background

Higher power deliver on computer circuit boards is increasing board temperature above 85º C and conventional plastic fasteners creep significantly at temperatures over 85º C, causing failures.�

Description

        � � � � � The disclosed method uses a formed metal component that is anchored in a retention mechanism (RM) or heatsink (see Figure 1). Hooking the fastener underneath the board edge forms a strong load path (see Figure 2). The fastener and hook are prevented from rotating (which causes unlatching) by filling the hole with solder. The solder is not highly stressed, which

significantly reduces solder creep under load.

        � � � � � The disclosed fastener can withstand board temperatures in excess of 100º C without significant creep-related failures.

        � � � � � The assembly sequence for the method is as follows:

1.        � � Preassemble the solder-lock fastener into the RM or heatsink

2.        � � Snap the solder-lock fasteners/RM into the plated through hole in the board

3.        � � Wavesolder the fastener into the hole

Advantages

        � � � � � Some implementations of the disclosed structure and method provide one or more of the following advantages:

•        � � � � Improved performance due to a high load capability by utilizing the strength of the fastener’s steel and using the solder to just prevent rotation of the clip...