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Method for the packaging/containment of processors for handling and shipment

IP.com Disclosure Number: IPCOM000010580D
Publication Date: 2002-Dec-18

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the packaging/containment of processors for handling and shipment. Benefits include improved reliability.

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Method for the packaging/containment of processors for handling and shipment

  

Disclosed is a method for the packaging/containment of processors for handling and shipment. Benefits include improved reliability.

Description

              The disclosed method utilizes a 2-piece thermoformed polyvinyl chloride (PVC) tray and lid for containment, handling, and shipment of processors for distribution to customers (see Figure 1). Extensive research and development was done to create a cavity/compartment for containment to avoid pin bending from the handling, shock, and vibration in the manufacturing and distribution processes.

 

              The processor sits in the tray with the IHS/die face down and pins up. The processor cavity contacts and locates the processor substrate only in the four corners (see Figures 2 – 7).

              The lid (see Figures 8 - 15) applies downward pressure onto the substrate on the centerlines. The lid also provides a dome over the pins so that space exists between the top of the pins and the top of cavity.

              The action of the tray and lid provide a cavity where the pins are free floating, but the processor is held rigidly within the cavity/compartment. Because the pins are free floating, they cannot be bent during handling and shock/vibration events.

              Exact dimensioning of the cavities and features is very specific to the disclosed method. Any cavity or feature that does not adhere to these dimensions can result in processor pin damage.

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