Browse Prior Art Database

Method for a thermal mechanical back plate

IP.com Disclosure Number: IPCOM000010581D
Publication Date: 2002-Dec-18
Document File: 3 page(s) / 101K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a thermal mechanical back plate (TMBP). Benefits include improved thermal performance, improved thermal resistance, and improved reliability.

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Method for a thermal mechanical back plate

Disclosed is a method for a thermal mechanical back plate (TMBP). Benefits include improved thermal performance, improved thermal resistance, and improved reliability.

General description

              The disclosed method is a TMBP. It is a cooling device and a printed circuit board (PCB) stiffener. The major components of the method include:

•             Aluminum plate

•             Flat-heat pipe assembly embedded into the plate

•             Thermal interface material (TIM)

•             Attachment mechanism that fastens the TMBP to a PCB

Advantages

              Some implementations of the disclosed structure and method provide one or more of the following advantages:

•             Improved thermal performance due to improved cooling

•             Improved thermal resistance due to preserving heatsink-to-CPU contact

•             Improved reliability of PCB components due to improved thermal performance

•             Improved reliability due to preventing components disconnects and cracked joints because of warpage reduction and eliminating preload

•             Improved cost effectiveness due to eliminating a heatsink

Detailed description

              The disclosed method is a TMBP (see Figures 1 and 2). It has both thermal and mechanical advantages. Thermally, the method eliminates a chip-set heatsink from the bill of materials (BOM) for a motherboard assembly, reducing the cost. Thermal resistance is improved by preserving heatsink-to-CPU contact because warping may introduce air gaps that increase thermal resistance. Therefore, a larger thermal solution may be allowable because larger retention forces can be balanced. The TMBP lowers the overall PCB temperature, increasing the reliability of the PCB components (such as metal oxide semiconductor field effect transistors and flip-chip plastic grid arrays).

              Mechanically, the disclosed method limits the PCB...