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Method for removable solder snap bars

IP.com Disclosure Number: IPCOM000010683D
Publication Date: 2003-Jan-08
Document File: 3 page(s) / 64K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for removable solder snap bars. Benefits include improved functionality, improved ease of manufacturing, improved throughput, and improved design flexibility.

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Method for removable solder snap bars

Disclosed is a method for removable solder snap bars. Benefits include improved functionality, improved ease of manufacturing, improved throughput, and improved design flexibility.

Background

        � � � � � Solder snap bars are sometimes required but cannot be designed into a PCB due to routing and space constraints.

        � � � � � Quality issues have been identified that are associated with solder bridging.

        � � � � � Conventionally, solder snap bars are added at the design phase of a PCB, if there is enough room.

        � � � � � If a component is required on a PCB but its addition will result in solder bridging problems, the PCB must be redesigned to add the feature.

        � � � � � A requirement exists for PCB redesign time and cost to be reduced or eliminated.

        � � � � � The conventional wave soldering process requires a temperature of 240oC.

Description

� � � � � The disclosed method is removable solder snap bars (see Figure 1). Adhesive copper pads are added to a PCB when routing constrains prevent the addition of solder snap bars to the PCB design. A pad is applied to a PCB before the wave processes at component locations that have high occurrences of solder bridging. After the wave process is completed, the pad can be removed from the PCB.

� � � � � The adhesive must be able to undergo temperatures of 260o-270oC. The temperatures represent a lead-free wave process.

        � � � � � The removable solder snap bar can be added to any through-hole mount technology component with a nonstaggered or stag...