Browse Prior Art Database

Method for removable solder snap bars

IP.com Disclosure Number: IPCOM000010683D
Publication Date: 2003-Jan-08
Document File: 3 page(s) / 67K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for removable solder snap bars. Benefits include improved functionality, improved ease of manufacturing, improved throughput, and improved design flexibility.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Method for removable solder snap bars

Disclosed is a method for removable solder snap bars. Benefits include improved functionality, improved ease of manufacturing, improved throughput, and improved design flexibility.

Background

              Solder snap bars are sometimes required but cannot be designed into a PCB due to routing and space constraints.

              Quality issues have been identified that are associated with solder bridging.

              Conventionally, solder snap bars are added at the design phase of a PCB, if there is enough room.

              If a component is required on a PCB but its addition will result in solder bridging problems, the PCB must be redesigned to add the feature.

              A requirement exists for PCB redesign time and cost to be reduced or eliminated.

              The conventional wave soldering process requires a temperature of 240oC.

Description

      The disclosed method is removable solder snap bars (see Figure 1). Adhesive copper pads are added to a PCB when routing constrains prevent the addition of solder snap bars to the PCB design. A pad is applied to a PCB before the wave processes at component locations that have high occurrences of solder bridging. After the wave process is completed, the pad can be removed from the PCB.

      The adhesive must be able to undergo temperatures of 260o-270oC. The temperatures represent a lead-free wave process.

              The removable solder snap bar can be added to any through-hole mount technology component with a nonstaggered or stag...