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Method for a two-phase device for active thermal control

IP.com Disclosure Number: IPCOM000010685D
Publication Date: 2003-Jan-08
Document File: 3 page(s) / 37K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a two-phase device for active thermal control (ATC). Benefits include improved thermal performance.

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Method for a two-phase device for active thermal control

Disclosed is a method for a two-phase device for active thermal control (ATC). Benefits include improved thermal performance.

Background

        � � � � � The conventional single-phase pump system is expected to begin running out of capability at about 200-250W.

General description

        � � � � � The disclosed method is a two-phase device for ATC. The present method pumps a single-phase working fluid through a heatsink and uses a single heater to modulate junction temperature (Tj).

        � � � � � The hollow portion of the heatsink cavity contains a spray nozzle for spraying the working fluid onto the bottom half of the heatsink that directly contacts the device under test (DUT). The bottom half of the heatsink contains a heater (see Figure 1).

        � � � � � If the measured Tj is lower than the required setpoint, the controller increases the heater’s power and/or decreases the spray atomizing pressure via the flow control valve. If the measured Tj is higher than the required setpoint, the controller decreases the heater’s power and/or increases the spray atomizing pressure.

        � � � � � The disclosed method optimizes the heatsink time constant.

        � � � � � The key elements of the method include:

•        � � � � Hollow heatsink

•        � � � � Heater

•        � � � � Controller

•        � � � � Spray atomizing nozzle

•        � � � � Pump

•        � � � � Flow control valve

•        � � � � Condenser

•        � � � � Fluid

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved thermal performance due to the improved efficiency in temperature control�

•        � � � � Improved thermal performance due to extending the maximum power envelope

•        � � � � Improved performance due to improved fluid flow rates

•        � � � � Improved performance due to improving the amount of...