Browse Prior Art Database

Method for a spray-cooled cold chuck for wafer test

IP.com Disclosure Number: IPCOM000010686D
Publication Date: 2003-Jan-08
Document File: 2 page(s) / 119K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a spray-cooled cold chuck for wafer test. Benefits include improved performance.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 55% of the total text.

Method for a spray-cooled cold chuck for wafer test

             

Disclosed is a method for a spray-cooled cold chuck for wafer test. Benefits include improved performance.

Background

              The use of spray cooling is reaching maturity. This technology is used by the military and others as an advanced thermal technology. The use of spray cooling to cool a wafer during test is an unconventional application of the technology. Suppliers are beginning to investigate refrigeration to cool the wafer.

              In conventional wafer test, the wafer is placed over a single-phase liquid cooled cold plate. A requirement exists to maintain the device junction temperature, Tj, below 35ºC with 0.7ºC/W from device junction to the cold chuck fluid.  Chiller technology is currently limited to -25ºC. With these requirements and limitations, the maximum achievable power density is about 100 W/cm2.

Description

              The disclosed method is a spray-cooled cold chuck for wafer test. The key components include:

•             Spray nozzles

•             Open-top cold chuck

•             Pump

•             Vapor-to-liquid heat exchanger

              The disclosed method is implemented by placing a wafer on top of the open-top cold chuck (see Figure 1). A slight vacuum precludes leakage and adjusts the working fluid saturation temperature as required. A rubber gasket ensures a seal between the wafer bottom surface and the cold chuck perimeter. At the start of testing, the wafer is directly sprayed from...