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Method for a spray-cooled cold chuck for wafer test

IP.com Disclosure Number: IPCOM000010686D
Publication Date: 2003-Jan-08
Document File: 2 page(s) / 38K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a spray-cooled cold chuck for wafer test. Benefits include improved performance.

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Method for a spray-cooled cold chuck for wafer test

        � � � � �

Disclosed is a method for a spray-cooled cold chuck for wafer test. Benefits include improved performance.

Background

        � � � � � The use of spray cooling is reaching maturity. This technology is used by the military and others as an advanced thermal technology. The use of spray cooling to cool a wafer during test is an unconventional application of the technology. Suppliers are beginning to investigate refrigeration to cool the wafer.

        � � � � � In conventional wafer test, the wafer is placed over a single-phase liquid cooled cold plate. A requirement exists to maintain the device junction temperature, Tj, below 35ºC with 0.7ºC/W from device junction to the cold chuck fluid.� Chiller technology is currently limited to -25ºC. With these requirements and limitations, the maximum achievable power density is about 100 W/cm2.

Description

        � � � � � The disclosed method is a spray-cooled cold chuck for wafer test. The key components include:

•        � � � � Spray nozzles

•        � � � � Open-top cold chuck

•        � � � � Pump

•        � � � � Vapor-to-liquid heat exchanger

        � � � � � The disclosed method is implemented by placing a wafer on top of the open-top cold chuck (see Figure 1). A slight vacuum precludes leakage and adjusts the working fluid saturation temperature as required. A rubber gasket ensures a seal between the wafer bottom surface and the cold chuck perimeter. At the start of testing, the wafer is directly sprayed from...