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Method for independent processor cooling in desktop PCs

IP.com Disclosure Number: IPCOM000010687D
Publication Date: 2003-Jan-08
Document File: 2 page(s) / 465K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for independent processor cooling in desktop PCs. Benefits include improved thermal performance, improved performance, and improved design flexibility.

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Method for independent processor cooling in desktop PCs

Disclosed is a method for independent processor cooling in desktop PCs. Benefits include improved thermal performance, improved performance, and improved design flexibility.

Background

� � � � � As processor power continues to increase, meeting thermal requirements becomes increasingly important. The maximum processor power that conventional desktop thermal designs can accommodate is about 75W.

        � � � � � Conventional desktop PC cooling is primarily a two-dimensional flow along the motherboard plane. Separation of processor cooling from system cooling is not possible without ducting, which increases airflow resistance. High cooling efficiency using a processor heatsink is not possible because two-dimensional flow requires longer airflow path. One conventional solution is a remote heat exchanger.

Description

        � � � � �         � � � � � The disclosed method is independent processor cooling in desktop PCs. Three-dimensional system airflow is created by a remote heat exchanger and a side-to-side airflow path (perpendicular to the plane of motherboard) for processor cooling. A power supply fan induces airflow parallel to motherboard for components cooling (see Figure 1).

        � � � � � For larger systems, an additional fan, which would have been required for venting processor exhaust, is no longer required.

        � � � � � For smaller systems, the power supply fan can be dedicated for system components cooling.

        � � � � � The key elements of the...