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Method for a Cu/diamond composite heatsink

IP.com Disclosure Number: IPCOM000010688D
Publication Date: 2003-Jan-08
Document File: 3 page(s) / 79K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a Cu/diamond composite heatsink. Benefits include improved functionality, improved thermal performance, and improved reliability.

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Method for a Cu/diamond composite heatsink

Disclosed is a method for a Cu/diamond composite heatsink. Benefits include improved functionality, improved thermal performance, and improved reliability.

Background

              As power dissipation of electronic device keeps increasing, a material with higher thermal conductivity is required to increase the heatsink efficiency.

      Conventionally, carbon/graphite fiber is used as the heatsink material. The carbon fiber results in 1.5X – 2.5X of Cu thermal conductivity along the fiber direction, while the thermal conductivity in the radial direction of fiber is very poor.

      Conventional heatsinks are used for electronic cooling. Some heatsinks are typically made by extrusion or CNC machining (see Figure 1), while other heatsinks (see Figure 2) are typically made by crosscut or die-casting.

General description

              The disclosed method is a Cu/diamond composite heatsink. The key elements of the method include:

•             Polymer base

•             Cu powder (99.99% purity)

•             Diamond grains (metal bond grade)

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to the capability to make complicated geometrical shapes for thermal efficiency and the capability to fit the heatsink into irregular spaces

•             Improved thermal performance due to Cu/diamond composite providing up to 2X the thermal conductivity of copper and 4X of thermal conductivity of aluminum

•             Improved reliability due to the reduction o...